Latest Electronics News
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Kingboard Holdings has sold a 4.92% stake in its laminates subsidiary, Kingboard Laminates Holdings, raising net proceeds of approximately HKD 11.8 billion – roughly EUR 1.4 billion. The capital is earmarked for PCB capacity expansion and multi-layer and HDI capabilities.
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Panasonic has brought out a compact HE-S SC 2a and HE-S SC 2a1b PCB relay series, specifically developed for single-phase EV charging systems and wallbox applications. The new relay series ...
The post Panasonic launches compact PCB relay series appeared first on Electronics Weekly.
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NASA has selected eight new companies to take part in its Commercial Satellite Data Acquisition (CSDA) programme. This will expand the range of commercial satellite data it makes available to ...
The post NASA expands Earth Observation dataset for its CSDA programme appeared first on Electronics Weekly.
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Influencers currently wield the biggest power over people’s purchasing decisions in Brazil, South Africa, China and India, according to a survey by Statista Consumer Insights. France,Austria, Belgium, the Netherlands, Sweden ...
The post Under The Influence appeared first on Electronics Weekly.
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Now in its eighth year, the EW BrightSparks awards see Electronics Weekly celebrate some of the brightest and most talented young engineers in the UK today. In the next in ...
The post EW BrightSparks 2025 profile: Oliver Tatlow, Leonardo appeared first on Electronics Weekly.
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PCB manufacturer Somacis Group has completed the acquisition of Group ACB, a PCB manufacturer with two sites in France and one in Belgium.
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A linearized output is a useful capacitive sensor design elaboration. But what if it's located some distance from the control electronics?
The post Position sensor gets linear 4 to 20mA current source output appeared first on EDN.
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Don't miss the latest episode of our Electronics Weekly podcast, CHIIPS. It features Edward Charrier - Fractilia's co-founder, CEO and President - and Chris Mack, Fractilia's co-founder and CTO.
The post CHIIPS #35 – CHIIPs with Fractilia’s Edward Charrier and Chris Mack appeared first on Electronics Weekly.
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Tesla has announced plans to hire 1,000 employees at its Gigafactory in Grünheide, near Berlin, as the company prepares to increase production. From October, the plant is expected to raise output to 7,500 vehicles per week, marking the next phase in the expansion of Tesla's European manufacturing hub.
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Volkswagen is reportedly planning to end its partnership with Bosch on the development of advanced driver assistance systems (ADAS) and autonomous driving technology. According to German newspaper Bild, which cited anonymous sources, the project failed to meet expectations despite investments of around EUR 1.5 billion.
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Molex is expanding its automotive HSAutoLink Interconnect portfolio. The HSAutoLink G connector provides multi-gig Ethernet connections of up to 25Gbps. It will address escalating bandwidth demands driven by Advanced Driver-Assistance ...
The post Molex releases HSAutoLink G automotive Ethernet connector system appeared first on Electronics Weekly.
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US defence contractor Lockheed Martin and Finnish technology company Insta are establishing Europe's first maintenance and support centre for the Common Fire Control System (CFCS) used in M270A2 and HIMARS rocket launchers. The facility will be located in Tampere, Finland.
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Fujifilm India aims to assess opportunities to establish a semiconductor materials production base in Dholera, Gujarat, while working closely with government stakeholders, industry bodies and private enterprises to strengthen a semiconductor supply chain.
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Germany's largest carmaker, Volkswagen, is reportedly preparing a sweeping cost-cutting programme that could include up to 100,000 job cuts, the closure of four plants in Germany, and reduced investment.
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The transaction will give Rocket Lab an immediate foothold in space-based applications, including both proprietary and standards-based satellite Internet of Things (IoT) and direct-to-device (D2D), PNT, and critical safety-of-life services.
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The semiconductor market divide between AI-driven infrastructure demand and traditional end markets is growing, says Counterpoint’s Q2 Lead Times report. While the market, in general, is experiencing a return to ...
The post Non-AI lead times normalising appeared first on Electronics Weekly.
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The optical transceiver market is expected to grow to more than $112 billion by 2031, driven primarily by AI infrastructure deployments, says Yole Group. AI is reshaping the competitive landscape, ...
The post AI transforming optical receiver market appeared first on Electronics Weekly.
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Cumulative AI RAN revenue is projected to reach $35 billion over the next five years (2026-2030) is not expected to expand the overall RAN market, says Dell’Oro. “AI RAN is ...
The post AI will enhance the RAN but won’t expand RAN market appeared first on Electronics Weekly.
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Vishay has extended its overcurrent protection portfolio with the introduction of six new surface-mount polymer positive temperature coefficient (PTC) thermistors. The devices provide resettable overcurrent protection in low voltage circuits ...
The post Vishay adds to polymer PTC thermistors appeared first on Electronics Weekly.
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The proposed transaction furthers Nightfood’s anticipated transformation into a diversified automation and advanced-manufacturing platform positioned at the intersection of semiconductor manufacturing, AI infrastructure, robotics, pharmaceutical automation, and industrial technology.
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A basic comparison between CoWoS, wafer-scale integration, and CoWoP establishes distinctions among package substrate, silicon wafer, and platform PCB.
The post CoWoS, wafer-scale and CoWoP: Why AI packaging bottleneck is moving appeared first on EDN.
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Ones and zeroes: are clustered or spread out bits better? "It depends," is the answer. Well, at least sorta.
The post Implementing a DAC: The battle of the PWMs appeared first on EDN.
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EMS provider Assel has completed the modernisation of its surface-mount technology (SMT) line. The Polish company has replaced its existing pick-and-place machines with three new ASM SIPLACE SX systems. The investment is expected to increase production efficiency, improve placement accuracy, and reduce line changeover times.
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Mixed-precision and transprecision floating-point designs offer compelling benefits but also amplify the risk of subtle correctness issues.
The post Hidden underflow in BF16 divider in mixed-precision FP designs appeared first on EDN.
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Need one more network port than available? A splitter can do the trick; spend a few extra bucks to make sure you’ve made the right pick.
The post Dissecting an active Ethernet splitter appeared first on EDN.
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Electronic article surveillance (EAS) tags quietly safeguard billions of dollars’ worth of merchandise every year.
The post EAS tags: The invisible backbone of retail security appeared first on EDN.
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Sometimes, getting true stress levels can be tricky because things happen that are sneaky.
The post Stress analysis appeared first on EDN.
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Just because generational device improvements aren’t in-your-face obvious doesn’t mean they aren’t sooner-or-later still tangibly impactful.
The post Google’s Pixel 10: Upgrading smartphones again appeared first on EDN.
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Ceva’s RealSpace Elevate is a Microsoft-certified Windows Audio Processing Object (APO) that enables spatial audio for PC gaming headsets.
The post Windows APO delivers customizable spatial audio appeared first on EDN.
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A 3D direct ToF LiDAR module, the VL53L9CX from STMicroelectronics offers 2.3k-zone resolution for low-compute edge AI systems.
The post LiDAR module generates high-resolution depth maps appeared first on EDN.