Latest Electronics News
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Odyssey Semiconductor Technologies, a semiconductor device company developing high-voltage power switching components based on GaN processing technology, has entered into a definitive agreement to sell substantially all of its assets to a large semiconductor company for USD 9.52 million in cash.
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Würth Elektronik is promoting PCBs with press-fit power connectors as the interconnection technology of choice for high-voltage power distribution in mobile machines and commercial vehicles. It has a design service ...
The post Wurth advocates press-fit PCB connections for high-voltage vehicle power distribution appeared first on Electronics Weekly.
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Harwin has launched a range of multi-GHz multi-pin board-to-board connectors that tolerate slight misalignment, shock and vibration. Branded Flecto, they are double-row, with up to 160 contacts, and come in ...
The post Multi-pin board-to-board connectors float 0.5mm for better alignment appeared first on Electronics Weekly.
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Manu Skyttä, PCB manufacturer Aspocomp's new President and CEO of Aspocomp, will assume his duties on May 20, 2024
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It’s been a while since I’ve done a Gadget Watch, and it’s even longer since I’ve played a guitar… Who knew you can now get practice amp dongles that plug ...
The post Gadget Watch: KATANA:GO, personal Headphone Guitar Amplifier dongle appeared first on Electronics Weekly.
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Electronics design engineers bear the responsibility of overcoming the world’s concerns with electric vehicle (EV) power sources. Lithium-ion batteries are heavy, put pressure on natural resources, and sometimes are slow to charge. The logical next step in EV development is using ultracapacitors as a complementary power source for when there are not enough batteries to go around, allowing electrification to scale and tone down the detractors of modern charging electronics.
Looking to ultracapaci...
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Earlier this year, Essemtec AG reached a milestone with the delivery its 40th machine to EMS provider Zollner Elektronik AG.
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Abaco Systems latest analogue front-end mezzanine card for FPGAs has been tailored for software defined radio, as well as electronic warfare, radar, test and measurement. FMC300, as it will be ...
The post 7GHz ADC-DAC card honed for FPGA software-defined radio appeared first on Electronics Weekly.
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Danish industrial group Mekoprint has signed an agreement to acquire the activities of Metalwo, a Danish developer and supplier of high-end user interface solutions.
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TES, a subsidiary of SK Ecoplant, has opened its new IT asset repurposing and processing facility in Fredericksburg, Virginia. The site is dedicated to extending the lifecycle of technology assets and data centre equipment.
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Evertiq has previously reported on Mycronic's possible listing Axxon – the core of the High Volume division. A move which the Swedish company claims would create the best possible conditions for Axxon to realise its full potential.
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By the end of 2024, the DRAM industry is expected to have allocated approximately 250K/m (14%) of total capacity to producing HBM TSV, with an estimated annual supply bit growth ...
The post HBM to be 14% of DRAM industry this year appeared first on Electronics Weekly.
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The magnetic sensor market is expected to reach $3.7 billion in 2029, with an estimated 4% CAGR from 2023 to 2029, says Yole Developpement. Allegro Microsystems leads in revenue, TDK ...
The post Magnetic sensors market has 4% CAGR 2023-29 to reach $3.7bn appeared first on Electronics Weekly.
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The White House Office of Science and Technology Policy (OSTP) has published the National Strategy on Microelectronics Research which provides the framework for federal departments and agencies, academia, industry, labour, ...
The post US strategy for microelectronics research published appeared first on Electronics Weekly.
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Sen, a UK space video company, is launching a 4K live stream looking out from the International Space Station (ISS) with the aim to enable people “to see Earth from ...
The post Sen launching 4K live stream of Earth from the ISS appeared first on Electronics Weekly.
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A new take on the concept of digital twins was announced by Nvidia at its developer conference in San Jose this week, as founder and CEO, Jensen Huang announced that ...
The post Nvidia offers Omniverse Cloud as APIs appeared first on Electronics Weekly.
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Here, 63 years ago, is an ad from Electronics Weekly’s edition of February 1st 1961
The post Tighter-Than-Ever-Specifications For Fast-Switching Low-Wattage Transistors appeared first on Electronics Weekly.
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The 222-microcircuit project described earlier in [1-3] is an analog of the 555 microcircuit. Her main purpose is the generation of rectangular pulses with an adjustable fill factor and independent frequency control. Such a chip is not produced industrially, although it is not difficult to a
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Japan’s efforts to reboot its chip industry are likely to get another boost: an advanced packaging facility set up by TSMC. That seems a logical expansion to TSMC’s $7 billion front-end chip manufacturing fab built in Kumamoto on Japan’s southern island Kyushu.
In other words, a back-end packaging facility will follow the front-end fab to complement th
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The high-bandwidth memory (HBM) landscape, steadily growing in importance for its critical pairing with artificial intelligence (AI) processors, is ready to move to its next manifestation, HBM3e, increasing data transfer rate and peak memory bandwidth by 44%. Here, SK hynix, which launched the first HBM chip in 2013, is also the first to offer HBM3e validation for Nvidia’s H-200 AI hardware.
HBM is a high-performance memory that s
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Outfitted with an Arm Cortex-7 core running at up to 600 MHz, ST’s STM32H7R/S MCUs provide the performance, scalability, and security of a microprocessor. They embed 64 kbytes of bootflash and 620 kbytes of SRAM on-chip to speed execution, while fast external memory interfaces support data transfer rates up to 200 MHz.
<img loading="lazy" decoding="async" class="aligncenter size-full wp-image-4497270" src="https://www.edn.com/wp
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An off-the-shelf S-Band low-noise amplifier, the TDLNA2050SEP from Teledyne, tolerates up to 100 krads of total ionizing dose (TID) radiation. This makes the part suitable for use in high-reliability satellite communication systems and phase-array radar.
<img loading="lazy" decoding="async" class="aligncenter size-full wp-image-4497273" src="https://www.edn.com/wp-content/uploads/Teledyne-TDLNA2050SEP.jpg?resize=800%
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Astera Labs has expanded its Aries PCIe/CXL Smart DSP retimer portfolio with devices that ensure robust PCIe 6.x and CXL 3.x connectivity. Doubling bandwidth to 64 GT/s per lane with automatic link equalization, Aries 6 retimers enable critical connectivity for AI server platforms and cloud infrastructure.
<img loading="lazy" decoding="async" class="aligncenter size-full wp-image-4497276" src="https://www.edn.com
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Embedded developers can deploy AI and ML models developed on Edge Impulse’s platform directly in Arm’s Keil microcontroller development kit (MDK). The partnership between the two companies makes it easier for engineers to collaborate with other cross-disciplinary teams to build edge AI products and bring them to market.
<img loading="lazy" decoding="async" class="aligncenter size-full wp-image-4497279" src="https://w
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Alphawave Semi announced the successful bring-up of its first chiplet-connectivity silicon platform on TSMC’s advanced 3-nm process. The silicon-proven Universal Chiplet Interconnect Express (UCIe) subsystem, capable of operating at 24 Gbps per lane, was demonstrated at the recent Chiplet Summit in Santa Clara, CA.
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Modern system-on-chip (SoC) designs require multiple interconnects for optimal performance, and here, cache coherent and non-coherent interconnects work together. In fact, it’s imperative that SoCs have an efficient combination of cache-coherent and non-coherent operations.
While SoC parts like accelerators and peripherals generally don’t require cache coherency, sharing a coherent view of memory and I/O is critical, so