Latest Electronics News
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The post Get Mannerisms, Gadget Master, the Daily and the Weekly, in newsletter form appeared first on Electronics Weekly.
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Jedec has officially updated the Universal Flash Storage (UFS) standard with UFS 5.0. It aims to increase storage performance and efficiency for edge device AI applications. The aim is improved ...
The post Jedec updates Universal Flash Storage for faster edge AI appeared first on Electronics Weekly.
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US memory manufacturer Micron Technology has officially opened its semiconductor assembly and test facility in Sanand, Gujarat, India.
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Omron’s S8AS2 compact smart power supply combines DC power supply, electronic circuit protection, and real-time monitoring in one panel-mountable unit. Reducing the number of components required in the control cabinet ...
The post S8AS2 smart power supply integrates power, protection, and diagnostics appeared first on Electronics Weekly.
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A multi-day weather-induced, utility electricity cutoff left this engineer’s residence unscathed…with one geriatric speaker exception.
The post A defunct Amazon Echo: Where did its acumen go? appeared first on EDN.
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There seems to be a pattern here: In July 2025, in a filing with the SEC. Intel stated: “We are focused on the continued development of Intel 14A and on ...
The post A Pattern Of Failure appeared first on Electronics Weekly.
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This collaboration has reached a milestone with InterQo, an EUR 4 million project that includes a bilateral industrial partnership between Pasqal and Welinq, alongside a dedicated research collaboration.
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By reducing radio power consumption and thermal management requirements while meeting spectral emissions targets with margin, Sierra enables a smaller and lighter radio design that simplifies installation and lowers total cost of ownership.
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Rohm is licensing TSMC’s GaN process technology and installing it at its Hamamatsu fab. Rohm has been running a GaN process at Hamamatsu for four years, initially with a 150V ...
The post Rohm licenses TSMC GaN process technology appeared first on Electronics Weekly.
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AST is engaged in maintenance, inspection and field services for rotating equipment such as compressors and steam turbines that drive compressors, used in resource and energy development sites, including in the oil and gas sectors.
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So far, GA-ASI has performed all the performance analytics and is confident in MQ-9 B’s ability to carry long-range weapons over long distances, while providing a measure of persistence and endurance.
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Following last year’s validation milestone, both companies will introduce the successful results of multi-cell testing conducted at Samsung’s R&D Lab, enabling scalable deployments and greater processor flexibility within software-based network environments.
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OpenAI has raised $110bn from Amazon, Nvidia and Softbank. Amazon put in $50bn and Nvidia and SoftBank put up $30bn each. The funding round values OpenAI at $730bn. “These partnerships ...
The post OpenAI completes $110bn funding round appeared first on Electronics Weekly.
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Siemens’ platform-independent and AI-enabled Simatic WinCC Open Architecture SCADA will connect eight renewable energy generation and storage assets in New South Wales, Victoria, Western Australia, and the Australian Capital Territory.
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The GEK1500 is a 1,500-lb thrust jet engine that could potentially power unmanned aerial systems (UAS), collaborative combat aircraft (CCAs) and missiles.
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Ericsson and Intel are collaborating for the transition to AI-native 6G deployments and use cases. The collaboration will span mobile connectivity, cloud technologies, and compute capabilities across AI-driven RAN and ...
The post MWC: Ericsson and Intel join for 6G AI-RAN appeared first on Electronics Weekly.
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Nvidia has hooked up with Booz Allen, BT, Cisco, Deutsche Telekom, Ericsson, MITRE, Nokia, OCUDU Ecosystem Foundation, ODC, SK Telecom, SoftBank and T-Mobile — to build 6G networks on AI-native, ...
The post MWC: Telecom companies and Nvidia pursue AI-RAN in 6G appeared first on Electronics Weekly.
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Semiconductor sales will grow 26% this year to $975bn, says a report from Deloitte’s. AI chips will be responsible for half the revenues while making up 0.2% of the units, ...
The post High margins and low volumes appeared first on Electronics Weekly.
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Siemens Digital has brought out an agentic toolkit, which brings agentic AI workflows to its Questa One verification software to accelerate creation, verification planning, execution, debugging and closure. The toolkit ...
The post Siemens Digital launches agentic toolkit appeared first on Electronics Weekly.
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Through this initiative, DNP will advance the development and mass production of EUV lithography photomasks and support Rapidus as it establishes a mass production system for 2nm & next-generation semiconductors.
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Having officially closed its acquisition of Lacon Group, EMS provider Incap Group has appointed Dr Ralf Hasler as the Director of Operations, Germany and Romania, and member of Incap Group’s Management Team.
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This latest USB standard does so much… is it a case of technical overreach, or a powerful solution to a chronic problem?
The post USB-C and Power Delivery: Too much of a good thing? appeared first on EDN.
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Keysight’s XR8 oscilloscope accelerates high-speed interface debug and compliance validation with powerful parallel, multicore analysis.
The post Scope boosts high-speed interface validation appeared first on EDN.
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MasterGaN6 from ST integrates two 650-V, 140-mΩ GaN transistors in a half-bridge configuration, delivering a compact, efficient power stage.
The post GaN half-bridge simplifies 650-V power stages appeared first on EDN.
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Kyocera AVX has expanded its 550/560 series of ultra-broadband MLCCs to support high-speed, high-bandwidth optical communication systems.
The post Low-loss MLCCs deliver wideband RF performance appeared first on EDN.
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The Iridium 9604 IoT module integrates satellite, LTE-M (Cat-M1), and multi-constellation GNSS into a compact 16×26×2.4-mm form factor.
The post 3-in-1 IoT module cuts complexity appeared first on EDN.
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Cavli’s CQM220 5G Reduced Capability (RedCap) module provides power- and cost-optimized 5G connectivity for IoT applications.
The post 5G RedCap module enables high-speed IoT connectivity appeared first on EDN.
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A solar charging kit, purchased after further promotional enticement, enables keeping a remotely located vehicle battery topped off.
The post Jumping the Jeep: An alternative cost-effective solar cell example app appeared first on EDN.
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Addressing reliable, accurate, and fast-acting voltage supervision that enables the reliable deployment of next-generation DC architectures.
The post Power Tips #150: Overcoming high-voltage monitoring challenges in gigawatt-scale data centers appeared first on EDN.
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Their ability to deliver precise motion feedback without external excitation makes them a cost-effective choice for speed and position sensing.
The post Variable‑reluctance sensors: From fundamentals to speed sensing appeared first on EDN.