Latest Electronics News
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Radiosondes, precision tool for science and playground for exploration, continue to inspire both professionals and hobbyists.
The post Radiosondes: Disposable guardians of the sky appeared first on EDN.
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Altera has partnered with Mercury Systems and VadaTech to expand its Agilex 9 FPGA ecosystem with COTS VPX boards for defense platforms.
The post Agilex 9 FPGAs power COTS VPX boards appeared first on EDN.
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onsemi has announced its Elite Pairing Studio – an online design tool that pairs SiC MOSFETs and gate drivers for power electronics applications, including AI datacentres, EVs, and industrial systems. ...
The post Pairing SiC MOSFETS and gate drivers appeared first on Electronics Weekly.
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I’ve featured a few high-end professional books recently, so it seems fair to return to the other end of the scale: here’s Electronics for Kids, 2nd Edition. Aimed at Junior ...
The post Gadget Book: Electronics for Kids appeared first on Electronics Weekly.
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The acquisition is expected to extend Nextpower’s technology platform across BESS and intelligent controls for critical power infrastructure.
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An estimated 2.4 billion people living in hot climates are expected to lack access to cooling systems by 2030, according to projections by the International Energy Agency (IEA). As prolonged, ...
The post Who Keeps Cool? appeared first on Electronics Weekly.
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Creating 1,200 construction jobs and 130 permanent high-tech positions at full operation, Nebius’s Independence (Missouri) investment is also expected to generate USD 650 million in tax payments to local school districts and taxing jurisdictions.
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Connectivity invariably comes with a price, literally and/or figuratively. Simple’s sometimes best, and ambient-light power’s also nice.
The post Not smart, but solar: Analyzing another thermo-plus-hygrometer appeared first on EDN.
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As AI factories scale globally, this strategic partnership enables memory supply to keep pace with Nvidia’s infrastructure roadmap and the sustained buildout of AI infrastructure worldwide.
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Infineon Technologies says that it will gradually transfer production from its backend manufacturing site in Tijuana, Mexico, to other locations in its global network. The company says the move is aimed at improving scalability, productivity and long-term competitiveness.
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At London Tech Week this morning, AMD chair and CEO Dr Lisa Su (pictured) outlined a series of investments worth £2bn designed to accelerate the UK’s AI ecosystem and support ...
The post AMD investing £2bn in UK appeared first on Electronics Weekly.
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At Interop Tokyo 2026, Nidec will introduce a prototype in-rack CDU (coolant distribution unit) with a cooling capacity of up to 300kW. The CDU is designed to manage the thermal ...
The post Nidec debuts highest capacity in-rack cooling prototype appeared first on Electronics Weekly.
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The Prime Minister’s speech to London Tech Week this morning showed an appreciation of British brain power. Sir Keir Starmer said that the UK gets half of all the tech ...
The post PM applauds British brains appeared first on Electronics Weekly.
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The company operates a fleet of all-electric, AI-optimized unmanned surface vessels to solve maritime infrastructure challenges. By utilizing AI for autonomous navigation and data analytics, it ensures operational efficiency without manual intervention.
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The mission of the semiconductor hub is to foster sustained collaboration between leading faculty and industry partners Broadcom, Applied Materials, GlobalFoundries, Meta and Synopsys to drive advances in connectivity, computing and intelligent systems.
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The DRAM industry posted revenue of USD 97 billion in the first quarter of 2026, up 81% quarter-on-quarter, driven by a rapid surge in contract prices for conventional DRAM. Contract prices rose approximately 93 to 98 percent compared to the previous quarter, according to TrendForce.
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At Embedded World 2026 we caught up with AMD’s Senior Director of Embedded Product Marketing, Amey Deosthali, as part of our promotional coverage for the event. He talks about how ...
The post Embedded World Video: AMD on what’s changing for AI and industrial robotics appeared first on Electronics Weekly.
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We recently caught up with AMD’s Director of FPGA Solutions, Manuel Uhm, as part of our promotional coverage for Embedded World 2026. He discusses how FPGAs are enabling efficient AI ...
The post Embedded World Video: AMD on FPGA Innovation and AI at the Edge appeared first on Electronics Weekly.
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The partnership represents an effort to extend the technologies developed under NTT’s Innovative Optical and Wireless Network (IOWN) into the space domain and accelerating the realization of the IOWN vision.
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The agreement establishes a cooperative framework to layer Integer Technologies’ DIGIT COMMAND operator software with Cellula Robotics’ mission control software for its advanced unmanned underwater vehicle (UUV) platforms.
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Intel’s five-nodes-in-four-years process technology catch-up was an attempt to go too far too fast, said CFO David Zinsner at the Bank of America 2026 Global Technology Conference in San Francisco ...
The post Rinse and repeat for Intel 14A appeared first on Electronics Weekly.
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April semiconductor sales of $110.5bn were 11% up on the $99.5bn of March 2026 and 93.9% more than the April 2025 total of $56.9bn, according to the SIA. The SIA ...
The post Semiconductor sales up 93.9% y-o-y in April, says SIA appeared first on Electronics Weekly.
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Norwegian company Nanopower Semiconductor’ nPZero Gen1 power management IC extends system lifetime by reducing the load on the main MCU. The agreement aims to reduce IoT power and increase battery life for UK and EU customers.
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A new technology reduces parasitic channel losses in GaN-on-silicon while boosting linearity and lowering power consumption.
The post The RF-ready GaN-on-silicon with lower parasitic losses appeared first on EDN.
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High efficiency is key in applications such as data centers, and new standards codify the now-mandatory requirements.
The post How to design a digital-controlled PFC, Part 4 appeared first on EDN.
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Here is a sneak peek at the evolution of the MLPerf benchmark and how generative AI forced a radical shift in AI hardware evaluation.
The post MLPerf and the rise of latency-aware LLM benchmarking appeared first on EDN.
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Clock speeds get faster. Per-cycle (and per-clock edge) address and data dollops get larger. And protocols get more efficient. But here we’re talking about external, not internal, buses.
The post Memory card interfaces keep pace with the internal bus evolution race: Part 1 appeared first on EDN.
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Here is how the prefill versus generation split exposes GPU structural inefficiencies in AI designs.
The post The hidden bottleneck in LLM inference and the impact on MLPerf benchmarking appeared first on EDN.
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Abundant use of the AI acronym is increasingly evident at various industry events. Strip away the hype layer and look deeper, however, and interesting trends still emerge into view.
The post Build 2026: Accumulating evidence of Microsoft’s AI independence appeared first on EDN.
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Digital signal controllers (DSCs) in Microchip’s dsPIC33CK Value Line provide real-time control for cost-sensitive designs.
The post Value DSCs streamline embedded control appeared first on EDN.