Latest Electronics News
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Kontron has selected Intel’s Core Ultra 7 and 5 (Meteor Lake U) processors for its latest 140 x 148mm mini-STX single-board industrial PC motherboard. “K4021-U mSTX features an integrated neural ...
The post Intel Core Ultra 7 in 5in industrial PC motherboard appeared first on Electronics Weekly.
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SMIC is testing a domestically manufactured immersion DUV lithography tool, reports the FT. The machine is made by Yuliangsheng of Shanghai, a government-backed start-up which employs many former Huawei engineers. ...
The post SMIC testing domestic immersion DUV machine appeared first on Electronics Weekly.
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As part of the collaboration, the companies will establish a state-of-the-art semiconductor validation and production test floor in Bangalore. The facility features clean room capabilities and equipment to productize silicon to volume production.
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Melexis has added a thermistor input to two of its combined current and voltage sensors. MLX91230KDC-BBC-200-RE is a ±512mT Hall-based sensor and comes in an SOIC8 MLX91231KGO-BBC-000-RE is a -100mV ...
The post Thermistor input added to ASIL C current-voltage sensors appeared first on Electronics Weekly.
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Nexcom is using Nvidia’s Jetson Orin Nano AI processing module in a rugged industrial PC for smart agriculture. ATC 3561-NA4C is rated at 67Top/s for AI inference – that is ...
The post Rugged industrial AI computer for smart agriculture appeared first on Electronics Weekly.
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Exploring how exploding capacitors in a commercial pressure washer due to a failed diode present serious safety concerns.
The post Pressure washer recall and aluminum electrolytic capacitors appeared first on EDN.
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Nexperia has four announced 100V automotive mosfets in a 12 x 12mm CCPAK1212 legged SMD package. This package saves “up to 40% PCB space compared to traditional TOLL or TOLT-packaged ...
The post 12 x 12mm mosfets vie with TOLL and TOLT in automotive appeared first on Electronics Weekly.
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Nvidia and Intel are teaming up to jointly develop multiple generations of custom data centre and PC products that aim to accelerate applications and workloads across hyperscale, enterprise and consumer markets.
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It could be argued that these were the most consequential inventors of the last 150 years: Moral: Great minds flock together
The post Fable: The Awesome Threesome appeared first on Electronics Weekly.
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Nvidia is to buy a 4% stake in Intel at $23.38 a share costing $5 billion. The Intel-Nvidia agreement calls for design co-operation but nothing on foundry. Intel will design ...
The post Nvidia invests $5bn in Intel appeared first on Electronics Weekly.
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Thermal management solutions company XNRGY has constructed a brand-new, 330,000-square-foot facility dedicated to producing its next-generation air-cooled chiller. This expansion marks XNRGY's fourth significant growth initiative in just three years, bringing its total current operational footprint to nearly 1,000,000 square feet.
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In terms of things catching our eye, we're talking SiTime MEMS resonators, a semiconductor market recovery, making infra-red radiation visible, and space for IoT...
The post What caught your eye? (MEMS resonators, Market recovery, Depth of field) appeared first on Electronics Weekly.
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NEO Battery Materials, a silicon-enhanced battery materials and components developer, has received its first, multi-year purchase order valued at CAD 4.5 million and secured a Joint Development Agreement for high-performance battery products with an Asian manufacturer specialising in AI-powered mission flight control systems for drones and unmanned aerial vehicles (UAV).
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US-based LA Semiconductor has launched the sale process for its wafer fabrication facility in Pocatello, Idaho, engaging Macquarie Group to oversee the transaction.
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Taiwanese electronics manufacturer Inventec has inaugurated a new 52,000 square metre production facility in South Moravia, Czech Republic, marking a significant expansion of its European footprint.
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Richardson Electronics has appointed Daniel Albers to spearhead business development for its expanded, "Made-in-USA" contract manufacturing efforts.
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Data acquisition for modern sensors is made simple with a new digitizer available in a USB 3.2 form factor.
The post High-speed digitizer boasts open FPGA architecture appeared first on EDN.
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Consumer electronics company Nothing has secured USD 200 million in a Series C funding round at a valuation of USD 1.3 billion, the company's CEO Carl Pei announced in a community update.
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China has reacted to having to take US chip hand-me-downs by telling its tech companies not to buy Nvidia’s chips which have been hobbled to meet US export restrictions. The ...
The post China objects to US chip hand-me-downs appeared first on Electronics Weekly.
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Smartphone production reached 300 million units in 2Q25, up 4% QoQ and 4.8% YoY, says TrendForce. The top six vendors collectively had around 80% market share. Samsung remained the largest ...
The post Q2 smartphone production up 4% QoQ and 4.8% YoY appeared first on Electronics Weekly.
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A capacitor matchmaker circuit can help make the odious chore of searching through a batch of parts for accurately matching pairs quicker.
The post Capacitor matchmaker appeared first on EDN.
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Class D amps are comparatively light weight, tiny, with high efficiency and cost-effectiveness. What’s not to like?
The post Class D: Audio amplifier ascendancy appeared first on EDN.
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Tektronix high-performance oscilloscope, the 7 Series DPO, is engineered for signal clarity through a high ENOB and low noise floor.
The post Tektronix releases its new high-performance 7 Series oscilloscope appeared first on EDN.
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Here is how designers can break functional systems into sub-functional chiplets and use advanced packaging integration technologies.
The post Putting 3D IC to work for you appeared first on EDN.
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A nifty contact-bounce simulator that can help validate debouncing techniques.
The post Fake contacts, bounced to order appeared first on EDN.
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The hands-on guide on cadence sensors provides practical setup tips for bikes and DIY projects.
The post The fundamentals of cadence sensing for pedal rotation tracking appeared first on EDN.
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TEOS 3D offers ultra-thick inter-die gapfill by leveraging bowed wafer handling and advancements in dielectric deposition.
The post Inter-die gapfill tool claims advanced packaging breakthrough appeared first on EDN.
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Generosity to customers is all well and good. But profitability is what makes shareholders happy.
The post Apple’s 2H 2025 announcements: Tariff-touched but not bound, at least for this round appeared first on EDN.