Latest Electronics News
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Harwin has launched a range of multi-GHz multi-pin board-to-board connectors that tolerate slight misalignment, shock and vibration. Branded Flecto, they are double-row, with up to 160 contacts, and come in ...
The post Multi-pin board-to-board connectors float 0.5mm for better alignment appeared first on Electronics Weekly.
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Ennovi has introduced a 10Gbit/s Ethernet connector with USCAR interface and press-fit PCB pins. Called Ennovi-Net, “this innovation completely avoids the need for soldering”, the company said. “As solder usage ...
The post Automotive 10Gbit/s+ Ethernet connector has push-fit PCB pins appeared first on Electronics Weekly.
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Danish industrial group Mekoprint has signed an agreement to acquire the activities of Metalwo, a Danish developer and supplier of high-end user interface solutions.
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TES, a subsidiary of SK Ecoplant, has opened its new IT asset repurposing and processing facility in Fredericksburg, Virginia. The site is dedicated to extending the lifecycle of technology assets and data centre equipment.
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Evertiq has previously reported on Mycronic's possible listing Axxon – the core of the High Volume division. A move which the Swedish company claims would create the best possible conditions for Axxon to realise its full potential.
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The anticipation of NAND Flash price hikes into Q2 has motivated certain suppliers to minimise losses and lower costs in hopes of returning to profitability this year. Kioxia and WD led the charge from March, boosting their capacity utilisation rates to nearly 90%—a move not widely adopted by their competitors, reports TrendForce.
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CG Power and Industrial Solutions Limited, Renesas and Stars Microelectronics recently signed an agreement to establish a joint venture to build and operate an OSAT facility in India.
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Korean memory giant Samsung is rumoured to have purchased a range of chipmaking equipment related to the mass reflow molded underfill (MR-MUF) method.
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By the end of 2024, the DRAM industry is expected to have allocated approximately 250K/m (14%) of total capacity to producing HBM TSV, with an estimated annual supply bit growth ...
The post HBM to be 14% of DRAM industry this year appeared first on Electronics Weekly.
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The magnetic sensor market is expected to reach $3.7 billion in 2029, with an estimated 4% CAGR from 2023 to 2029, says Yole Developpement. Allegro Microsystems leads in revenue, TDK ...
The post Magnetic sensors market has 4% CAGR 2023-29 to reach $3.7bn appeared first on Electronics Weekly.
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The White House Office of Science and Technology Policy (OSTP) has published the National Strategy on Microelectronics Research which provides the framework for federal departments and agencies, academia, industry, labour, ...
The post US strategy for microelectronics research published appeared first on Electronics Weekly.
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Sen, a UK space video company, is launching a 4K live stream looking out from the International Space Station (ISS) with the aim to enable people “to see Earth from ...
The post Sen launching 4K live stream of Earth from the ISS appeared first on Electronics Weekly.
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A new take on the concept of digital twins was announced by Nvidia at its developer conference in San Jose this week, as founder and CEO, Jensen Huang announced that ...
The post Nvidia offers Omniverse Cloud as APIs appeared first on Electronics Weekly.
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Here, 63 years ago, is an ad from Electronics Weekly’s edition of February 1st 1961
The post Tighter-Than-Ever-Specifications For Fast-Switching Low-Wattage Transistors appeared first on Electronics Weekly.
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As accelerated computing reaches its tipping point, Nvidia’s CEO explained the company’s plan is not to drive down costs but to scale up performance. He was speaking at Nvidia GTC ...
The post Blackwell GPU shares Hopper architecture but ramps up performance appeared first on Electronics Weekly.
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Corning has created an optical fibre connector system that aligns 12 fibres in a single operation to bring data to homes. “Multifiber Pushlok is a ‘stick-and-click’ [that] allows operators to ...
The post Multiple fibres aligned in a single connector for street installation appeared first on Electronics Weekly.
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The 222-microcircuit project described earlier in [1-3] is an analog of the 555 microcircuit. Her main purpose is the generation of rectangular pulses with an adjustable fill factor and independent frequency control. Such a chip is not produced industrially, although it is not difficult to a
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Japan’s efforts to reboot its chip industry are likely to get another boost: an advanced packaging facility set up by TSMC. That seems a logical expansion to TSMC’s $7 billion front-end chip manufacturing fab built in Kumamoto on Japan’s southern island Kyushu.
In other words, a back-end packaging facility will follow the front-end fab to complement th
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The high-bandwidth memory (HBM) landscape, steadily growing in importance for its critical pairing with artificial intelligence (AI) processors, is ready to move to its next manifestation, HBM3e, increasing data transfer rate and peak memory bandwidth by 44%. Here, SK hynix, which launched the first HBM chip in 2013, is also the first to offer HBM3e validation for Nvidia’s H-200 AI hardware.
HBM is a high-performance memory that s
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Outfitted with an Arm Cortex-7 core running at up to 600 MHz, ST’s STM32H7R/S MCUs provide the performance, scalability, and security of a microprocessor. They embed 64 kbytes of bootflash and 620 kbytes of SRAM on-chip to speed execution, while fast external memory interfaces support data transfer rates up to 200 MHz.
<img loading="lazy" decoding="async" class="aligncenter size-full wp-image-4497270" src="https://www.edn.com/wp
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An off-the-shelf S-Band low-noise amplifier, the TDLNA2050SEP from Teledyne, tolerates up to 100 krads of total ionizing dose (TID) radiation. This makes the part suitable for use in high-reliability satellite communication systems and phase-array radar.
<img loading="lazy" decoding="async" class="aligncenter size-full wp-image-4497273" src="https://www.edn.com/wp-content/uploads/Teledyne-TDLNA2050SEP.jpg?resize=800%
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Astera Labs has expanded its Aries PCIe/CXL Smart DSP retimer portfolio with devices that ensure robust PCIe 6.x and CXL 3.x connectivity. Doubling bandwidth to 64 GT/s per lane with automatic link equalization, Aries 6 retimers enable critical connectivity for AI server platforms and cloud infrastructure.
<img loading="lazy" decoding="async" class="aligncenter size-full wp-image-4497276" src="https://www.edn.com
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Embedded developers can deploy AI and ML models developed on Edge Impulse’s platform directly in Arm’s Keil microcontroller development kit (MDK). The partnership between the two companies makes it easier for engineers to collaborate with other cross-disciplinary teams to build edge AI products and bring them to market.
<img loading="lazy" decoding="async" class="aligncenter size-full wp-image-4497279" src="https://w
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Alphawave Semi announced the successful bring-up of its first chiplet-connectivity silicon platform on TSMC’s advanced 3-nm process. The silicon-proven Universal Chiplet Interconnect Express (UCIe) subsystem, capable of operating at 24 Gbps per lane, was demonstrated at the recent Chiplet Summit in Santa Clara, CA.
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Modern system-on-chip (SoC) designs require multiple interconnects for optimal performance, and here, cache coherent and non-coherent interconnects work together. In fact, it’s imperative that SoCs have an efficient combination of cache-coherent and non-coherent operations.
While SoC parts like accelerators and peripherals generally don’t require cache coherency, sharing a coherent view of memory and I/O is critical, so
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When a load is driven simultaneously by more than one source with each source being of its own frequency, the individual load power deliveries from those sources are independent of each other. Whatever power any one of those sources would provide to the load all by itself, that power delivery will not be affected by the presence of the absence of the other sources.
Imagine a stack of voltage sources connected in series and feeding into some load resistance, R. It could look something like Figure...