Latest Electronics News
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AI-based digital post-distortion gains attention as uplink modulation performance and efficiency requirements grow on the path to 6G.
The post From 5G uplink testing to 6G research: AI DPoD in the lab appeared first on EDN.
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At Embedded World North America the wireless specialist Quectel has announced its QSM603FCP, a “smart PCBA” for edge computing that supports Android and Linux systems. It runs on MediaTek’s high-performance […]
The post QSM603FCP smart board supports AIoT for Android, Linux appeared first on Electronics Weekly.
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The most popular ones on the site cover record revenue in the server market, Samsung running prototypes of Tesla’s 2nm A15 chip, and OpenLight sampling the first 3.2T DR8 silicon photonic power ICs.
The post Most Read – Prototyping Tesla’s A15, LPDDR5X DRAM, Silicon photonics PICs appeared first on Electronics Weekly.
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6G standardization is advancing through the 3GPP, with releases studying AI, sensing, and new architecture on the road to commercial rollout.
The post 5G to 6G: AI moves into the network appeared first on EDN.
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In May 1998 EW carried this yarn: ’Intel chairman Andy Grove, having handed over operational duties to president Craig Barrett, was discharging his new role as industry mentor in Asia […]
The post The Bringer Of Peace, Love And A Kicking appeared first on Electronics Weekly.
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Google’s Project Suncatcher is scheduled to send its first prototype satellite into orbit next week, to evaluate how Google Tensor Processing Units (TPUs) perform in space. Google describes the project […]
The post Google’s Suncatcher aims for datacentres in space with TPU moonshot appeared first on Electronics Weekly.
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You don't have to be Superman (or even just use phone booths as changing stations) to find this author's recent research results disturbing.
The post Neon lamps and Krypton 85 appeared first on EDN.
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Bittium is a supplier of resilient tactical communications systems, secure mobile communications and software-defined radio technology. The companies will explore how their capabilities can be combined to meet the communications needs of the French armed forces.
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Honda plans to invest about USD 1.90 billion to USD 2.53 billion in the new facility, which is slated to start production in 2030, Nikkei reports.
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Through AI-powered EDA flows, multiphysics-aware signoff methodologies, multi-die design flows, and silicon-proven Interface and Foundation IP, Synopsys and TSMC are helping customers address growing design complexity.
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CSignum, a startup for wireless IoT communications from beneath the surface, has completed a £2.6 million funding round. This follows on from previous Series A investment. The backing will enable […]
The post CSignum secures £2.6m funding for underwater wireless comms appeared first on Electronics Weekly.
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The funding allows the Helsinki-based company to accelerate product development across all layers of its AI cloud, from compute capacity to platform services for frontier AI teams in the agentic era.
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OIS has become a must-have feature in a variety of mobile devices due to consumer demand for high-quality photography and videography.
The post More cost-effective OIS brings better photo/video quality to mobile devices appeared first on EDN.
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Kelington will support the delivery of critical infrastructure and systems required for semiconductor manufacturing. The partnership will enable Tata Electronics to accelerate the facility’s operational readiness for silicon wafer production.
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Located in the Namyong Terminal Free Zone in the Bueng Subdistrict of Si Racha District, the 2,318-square-meter facility offers packaging, final assembly, pack-on-site services and in-lane logistics for customers in Thailand and throughout Southeast Asia.
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The Niepołomice facility already provides precision components for multiple engine types, including the Pratt & Whitney GTF engine powering commercial passenger aircraft, the PW800 powering business jets and the F135 powering all variants of the F-35 Lightning II fighter aircraft.
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Despite Prime Minister Andy Burnham telling the UN that the UK and US are working hand in glove on AI safety the US has told OpenAI and Anthropic not to […]
The post UK blocked from pre-release access to US AI frontier models appeared first on Electronics Weekly.
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Terafab is either a massive chip fab being built by Elon Musk in Texas or a desk-top photolithography tool for prototyping devices (pictured above). No doubt Elon was surprised to […]
The post Which is the real Terafab? appeared first on Electronics Weekly.
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AI accelerators , HBM Integration, and Co-packaged optics are pushing higher performance packaging past $51 billion by 2031, says Yole. High-end performance packaging revenue has a 27% CAGR during 2025-2031. […]
The post Advanced packaging to be a $51bn market by 2031 appeared first on Electronics Weekly.
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The UK has added 16 unicorns so far this year taking the country’s current total to 100 unicorns with 91 reaching unicorn status since 2017, according to Tracxn Technologies. This […]
The post UK adds 16 Unicorns so far this year appeared first on Electronics Weekly.
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Mikroe, the click board specialist, has come up its Spatial Anchor S1 and Spatial Anchor R1 precise spatial accessory tracking modules for Apple’s Vision Pro headset. Both are now shipping […]
The post Spatial accessory trackers for Apple headsets appeared first on Electronics Weekly.
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The new built-in Model Context Protocol (MCP) support complements Simio’s existing AI capabilities by enabling organizations to connect preferred, compatible generative AI applications powered by large language models (LLMs) to Simio.
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As part of this collaboration, Siemens and TSMC have enabled an AI-powered agent for automated design rule check (DRC) fixing across digital and custom integrated circuit (IC) design flows.
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An intermediary was transporting the parts on behalf of F-35 manufacturer Lockheed Martin. It wasn’t immediately clear why the shipment was rerouted or how it ended up in Hong Kong. The F-35 is one of the world’s most advanced fighter jets.
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Long life? Power efficient? Color temperature flexibility? Drop-in replacement? Yes please, I'll take one of these!
The post LEDs for under-cabinet illumination upgrades appeared first on EDN.
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Antennas on consumer products have gone from very visible to literally unseen.
The post How did antennas get so small? appeared first on EDN.
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Cadence has added an agent for RTL generation to its ChipStack AI Super Agent platform for front-end silicon design and verification.
The post AI agent automates PPA-driven RTL generation appeared first on EDN.
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Omnivision’s OAX7700 ultra-low-power ASIC is an always-on vision AI companion processor for vehicle security systems.
The post Vision AI ASIC enables always-on vehicle security appeared first on EDN.
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Eggtronic has announced a 140-W USB-C Power Delivery (PD) 3.1 AC/DC reference design for notebook adapters and other USB-C powered devices.
The post Reference design cuts complexity in USB-C adapters appeared first on EDN.
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The Melexis MLX91224 and MLX91225 isolated Hall current sensors measure up to 100 A RMS in automotive and energy applications.
The post Sensors extend current measurement to 100 A appeared first on EDN.